Home > Journals > Tien Tzu Hsueh Pao Acta Electronica Sinica Impact Factor, Quartile, Indexing, Ranking
Tien Tzu Hsueh Pao Acta Electronica Sinica (TTHPAES) is a scholarly journal dedicated to publishing research in the field of Engineering, and Published by Chinese Institute of Electronics. The Print-ISSN of Tien Tzu Hsueh Pao Acta Electronica Sinica is 0372-2112 and its abbreviation is Tien Tzu Hsueh Pao Acta Electron Sin.
The Publication fees (APC) is 1000.00 RMB.
Acta Electronica Sinica aims to provide services for promoting academic exchanges and accelerating the development of science and technology in electronics and information science.
Acta Electronica Sinica is dedicated to reflecting, not only new theories, new ideas, and new technologies in China, but also the latest research results and the latest technological progress worldwide in the fields of electronics and information science.
The scope of Acta Electronica Sinica includes, but is not limited to:
- Microelectronics
- Circuits and systems
- Electromagnetic field theory and microwave technology
- Telecommunication technology
- Signal and information processing
- Computer science and technologies
- Networking
- Interdisciplinary applications
| Journal title | Tien Tzu Hsueh Pao Acta Electronica Sinica (TTHPAES) |
| Abbreviation | Tien Tzu Hsueh Pao Acta Electron Sin |
| Print ISSN | 0372-2112 |
| Publisher Name | Chinese Institute of Electronics |
| Editor-in-chief | HAO Yue |
| Subject Category | Engineering |
| Access type | 🔒 Subscription |
| Status | 🟢 Active |
In the context of academic journals, "Metrics and Rankings" refer to various measures and evaluations used to assess the quality, influence, and impact of a journal.
Below are the metrics and rankings for the journal Tien Tzu Hsueh Pao Acta Electronica Sinica
Abstracting and Indexing (A&I) refers to the processes that help organize and categorize academic journals, making them easier to find and access for researchers and scholars
| Abstracting and Indexing |
If you would like to submit a manuscript or visit the journal's website, please click on the link below.
| Journal Submission | 🔗 Journal Website |
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